氮化镓系统 (GaN Systems)’ CEO to Deliver PCIM Keynote on GaN and New Hardware Innovations Driving Industry 4.0

OTTAWA, Ontario, Canada, April 24, 2019 – 氮化镓系统 (GaN Systems), the global leader in GaN (gallium nitride) power semiconductors, today announced that its CEO Jim Witham will deliver a keynote at PCIM Europe, the leading international exhibition and conference for power electronics and its applications, in Nuremberg, Germany May 7-9, 2019. Witham’s presentation, “GaN and Industry 4.0 – A Small Change that is Revolutionizing the Industry,” will be taking place Thursday, May 9, 2019 at 8:45 a.m. at Room Brüssel 1. He will also be hosting a Q&A session following the keynote from 12:20-12:50 p.m. at Room Mailand.

Witham will share a unique perspective on Industry 4.0 and how power electronics is playing a big role in breaking down the many technology challenges affecting this sector, especially the hardware innovation that needs to happen in the hundreds of millions of motors, motor drives, robots, and robotics needed in today’s industrial spaces.

Industrial use accounts for more than 40% of the world’s electricity use with two-thirds of that alone used by industrial motors. In the midst of the fourth Industrial Revolution new technology and energy requirements necessitate innovation in motor drives and robotics and in the data centers that support smart factories and facilities. GaN is advancing this revolution by enabling smaller, higher efficiency motors and motor drives as well as smaller and higher precision robotics. Robots, as they move to the new levels of autonomy and precision needed to support industry 4.0, will greatly benefit in advancements in motors and wireless charging.

In addition, several 氮化镓系统 (GaN Systems)’ experts will be participating in the following speaker sessions:

Date/Time	Location	Speaker(s)	Topic
May 7, 2019 12:00-13:00	Hall 7, Booth 543	Jim Witham, 氮化镓系统 (GaN Systems)+ others	INDUSTRY FORUM: Getting Going with GaN – The session will look at the benefits that can be achieved by using GaN and the best practices for designing products with GaN. Directly after the presentation. Meet Jim at Hall 7, Booth 546
May 8, 2019 14:30-15:30	Hall 7, Booth 543	Jim Witham	BODO PODIUM DISCUSSION ON WIDE BAND GAP DEVICES: GaN – Devices are Mature
May 8, 2019 15:15-17:15	Foyer Ground Floor Entrance NCC Mitte	Tiefeng Shi	POSTER SESSION: Low cost 50W Class EF2 PA for Magnetic Resonance Wireless Power Transfer Applications
May 9, 2019 14:50-15:15	Room Mailand	Lucas Lu	ORAL SESSION: Parasitics Optimization for GaN HEMTs in Conventional Housing-type Power Modules
May 9, 2019 15:15-15:35	Room Brüssel 1	Roy Hou	ORAL SESSION: The Effect of Dynamic On-state Resistance to System Losses in GaN-based Hard-Switching Applications

 

For more information, please visit 氮化镓系统 (GaN Systems) at PCIM Europe in 氮化镓系统 (GaN Systems) Booth 9-507 or contact a local representative.

 

Additional media coverage of this announcement can be found at Power Electronics News, Semiconductor Today and Compound Semiconductor.